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Parameters
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Parameters

SERIAL ITEM TECHNICAL DATA
1 Layers 2-30(layers)
2 Max Board Size 18" x 24"
3 Min Board Thickness 4(layers)16mil
6(layers)32mil
8(layers)40mil
10(layers)48mil
4 Min Line Width 4mil
5 Min Line Space 4mil
6   Min Hole Size 8mil
7   PTH Wall Thickness 0.8mil
8   PTH dia tolerance ±2mil
9  NPTH hole dia tolerance ±1mil
10   Hole Position Deviation ±2mil
11   Outline Tolerance ±4mil
12 S/M Pitch 3mil
13   Insulation Resistance 1E+12Ω(Normal)
14 Aspect ratio 10:1
15  Thermal Shock 3x10Sec@288 ℃
16 Warp and Twist ≤0.7%
17 Electric Strength >1.3KV/mm
18 Peel Strength 1.4N/mm
19 Solder Mask Abrasion ≥6H
20 Flammability 94V-0
21 Impedance Control ±5%